The Fast Company Executive Board is a private, fee-based network of influential leaders, experts, executives, and entrepreneurs who share their insights with our audience. BY Sviat Dulianinov The AI ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a ...

A software-powered simulation for assembly behavior can compensate for the gap in automation by building intuition in the safety of a high-fidelity digital twin. The best way to align a screw is a ...

The integration level of a system-on-chip (SoC) is defined in RTL, just like the rest of the design. Historically, RTL has been built through text editors. However, a decade or more ago, the sheer ...

Design-for-assembly (DFA) and design-for-manufacture (DFM) techniques can be applied to products assembled manually or automatically or manufactured by specific techniques, such as machining, die ...

The Fred Young Submillimeter Telescope (FYST) is a 6-meter-diameter state-of-the-art telescope designed to operate at submillimeter to millimeter wavelengths for wide field observations and large-area ...

Using data from a CAD file, a two-arm robotic system automatically places pins on a harness board and routes wires between ...

Assembly production lines play an important role in modern manufacturing by optimizing processes to improve production efficiency. Below are two typical application cases and their analyses. The ...

Software automation in PCB assembly. Advantages and disadvantages of software automation in PCB assembly. The PCB assembly (PCBA) process is becoming more complex with evolving market trends such as ...

Engineers have developed a robot that can identify, collect, and manipulate two-dimensional nanocrystals. The robot stacked nanocrystals to form the most complex van der Waals heterostructure produced ...